Mechanical/Systems Engineer - Mountain View  

This position is based in Mountain View, CA.

That area: Platforms

Google's global deployment of custom-designed machines and data centers has created one of the largest and most powerful computing infrastructures in existence: cutting-edge innovation on a huge scale. You will design and build the software, hardware, computing platform and networking technologies that power all of Google's services.

The role: Mechanical/Systems Engineer

You are a mechanical/thermal engineer with expertise in electronics packaging and data center design. You will assume responsibility for the definition, design, and analysis of multiple platforms ranging from the package level, to system level, and out into your data centers. You will satisfy all performance and reliability specifications, while optimizing for efficiency and flexibility.

Responsibilities:

• Contribute to overall system architecture from “chip to chiller” with the ability to make interdisciplinary tradeoffs to optimize TCO of overall compute infrastructure.
• Develop holistic mechanical designs from package to data center level optimizing for cost and efficiency.
• Design and specification of thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, and all supporting equipment.
• Develop appropriate specifications and test procedures as necessary to ensure desired reliability and performance of electronic equipment.
• Mentor junior engineers in all aspects of concept development, analysis, design, and specification.

Requirements:

• M.S. in Mechanical Engineering or equivalent is required, PhD and/or P.E. preferred
• At least 12 years experience in electronics packaging or related industry with expert knowledge of cooling strategies used at the package, board, and system, and data center.
• Successful application of one or more advanced cooling techniques such as liquid cooling, thermo-electric devices, two-phase heat transfer, and heat exchangers.
• Experience with op/non-op shock/vibe issues related to electronics packaging.
• Extensive knowledge of CFD, thermal analysis techniques, pipe flow (pressure drop) calculations, and structural modeling techniques. Additional consideration given for FLOTHERM and Mechanica experience.
• Experimental experience specifically related to capturing acceleration, displacement, sound, temperature, pressure, velocity, power, and flow rates.